FITLET3 |Intel® Celeron J6412 (1st deliveries expected May 2022)

(Artikelnr: fitlet3-CJ6412-S-W210M)
Barebone fitlet3-CJ6412-S-W210M  with  Celeron J6412 (4C, 2.0GHz, 10W) , Terminal block w/ RS-232, RS-485, GPIOs and  M.2 module Intel AX210 WiFi/BTBT 


  • Up to 32 GB 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S

  • M.2 Key-M accepts SATA of NVME modules, 2230, 2242, 2260 or 2280

  • mini DP 1.2 | DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
  • HDMI 1.4b | HDMI 1.4b (up to 3840 x 2160 @ 30Hz)

  • LAN- Up to 4x Gbit Ethernet Intel I210
  • 2x Gigabit on-board Ethernet ports on RJ45 (2x Intel® i210 1000 Mbps / 100 Mbps / 10 Mbps)

Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card
Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card
Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card

M.2 Key-E
1 Optional On-board module with Wi-Fi 6E, BT 5.2, for M.2 2230 module with Wi-Fi 6E, BT 5.2

Cellular communication (Optional)

M.2 Key-B
Available using M.2 Key-B socket on a fitlet3 SBC for M.2, LTE/5G modem, with micro-SIM tray. fitlet3 SBC is equipped by micro-SIM socket.

  • USB 6 on-board ports (2x USB 3.0 + 4x USB 2.0)
  • Audio (*optional) provided upon request Optional analog output, analog input on 3.5 mm jacks
  • HDMI & DP audio
  • Isolated serial and GPIO, up to 24V, on terminal block
  • Optional isolated RS-232/422/485
  • 2x isolated GPI + 2x isolated GPO
Function and Connectivity Extension T-Card (FACET Card) interface

Available FACET-Cards
dual Gbit Ethernet
1x PoE
1x SFP+
FACET Card interface includes 2x PCIe, USB, eDP 1.3 and I2C.

M.2 E-key socket*
* Shared with FACET Card socket


  • AMI Aptio V
Operating systems:
  • Windows 10 Pro
  • Windows 10 LTSC 2021 IoT Enterprise
  • Windows 11 Pro
  • Linux Mint
  • Compatible with other Windows 10 /11 variants.
  • Compatible with other Linux variants.
  • Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)

  • Input voltage range - DC 7V – 42V
  • Power consumption - 5W – 25W
  • Power consumption depends on - CPU type - System load - Installed devices - Connected peripherals

Temperature & humidity
  • Operating temperature range -Up to -40°C to 85°C*
  • Relative humidity -5% – 95% non-condensing

Shock and vibration
MIL STD 810G compliant

Vibration test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis)
Shock test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions)

Mechanical specifications

Dimensions & weight
  • Standard housing: 132.8 mm X 100 mm X 34.8 mm
  • Industrial housing: 140 mm X 111 mm X 34.8 mm
Weight: 420 gram
The user can easily change the housing type in the field.

Housing & cooling
  • All metal housing
  • Aluminium zinc die cast parts
  • Fanless convection cooling through the housing,  no vents

VESA / wall mounting bracket*
DIN-rail mounting bracket*

* = Optional
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